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Workshop Program

Nov. 27 (Fri)

FR1A  Workshop

Nov. 27 (Fri)  09:30-11:30   Room 1 (Annex Hall F201)
(TBD)
Organizers :  Issei Sygano (KDDI Research, Inc.)
Chair :   (TBD)

Keyword :
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FR1B  Workshop

Nov. 27 (Fri)  14:00-16:00   Room 1 (Annex Hall F201)
(TBD)
Organizers :   (TBD)
Chair :   (TBD)

Keyword :
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4 (TBD)
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FR2A  Workshop

Nov. 27 (Fri)  09:30-11:30   Room 2 (Annex Hall F202)
Latest Trends in Terahertz Sensing Technologies
Organizer / Chair :  Ichiro Somada (Mitsubishi Electric Corp.)
Terahertz waves are electromagnetic waves in the frequency range of 100GHz to 10THz, positioned between light waves and radio waves, and they possess a variety of distinctive characteristics. Terahertz sensing is expected to find broad applications, including high-resolution sensing of objects' interiors using the 100GHz band and object identification based on object-specific absorption spectra above 500GHz.
In this session, we will invite speakers conducting cutting-edge research on the diverse uses of terahertz technology-including tomography, bioimaging, and remote sensing from space-to present their latest research results.

Keyword : Terahertz, Bio Imaging, Tomographic Imaging, Remote Sensing,
1 Development of Terahertz Point Source Technology and Terahertz Applications in Bioimaging and Sensing
Kazunori Serita (Waseda Univ.)
2 Technologies Constituting Sub-THz 3D Imaging
Takuya Suzaki, Ichiro Somada (Mitsubishi Electric Corp.)
3 Terahertz Remote Sensing : Observations and Data from Space
Takeshi Kuroda, Yasuko Kasai (NICT)

FR2B  Workshop

Nov. 27 (Fri)  14:00-16:00   Room 2 (Annex Hall F202)
(TBD)
Organizers :   (TBD)
Chair :   (TBD)

Keyword :
1 (TBD)
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FR3A  Workshop

Nov. 27 (Fri)  09:30-11:30   Room 3 (Annex Hall F203)
(TBD)
Organizer / Chair :  Yoshitaka Araida (Sumitomo Electric Industries, Ltd.)
In recent years, research and development for next-generation communications such as 5G-Advanced / 6G have been actively pursued. Among the key components, power amplifiers are one of the most important, and extensive studies have been conducted not only on output power and efficiency, but also on load-variation tolerance, implementation technologies, linearity, and related factors.
In this session, we will present talks on a mode-reconfigurable GaN power amplifier for enhanced VSWR resilience, a 7GHz GaN amplifier module using film laminating technology, linearization technique for FR3 GaAs HBT PA using vector-sum phase shifter, and the latest trends in digital pre-distortion technique for GaN power amplifiers.

Keyword :
1 A Mode-Reconfigurable GaN Power Amplifier for Enhanced VSWR Resilience
Tomohiro Yao, Takuma Torii, Shuichi Sakata (Mitsubishi Electric Corp.)
2 A High-Efficiency GaN Amplifier Module Using Film Laminating Technology for 7GHz Band 5G Base Stations
Hayato Shimizu, Tatsuya Hashinaga, Yutaka Moriyama, Takeshi Kawasaki, Hideki Tango (Sumitomo Electric Device Innovations, Inc.)
3 A Vector-Sum Phase Shifter-Based Linearization Technique for FR3 GaAs HBT Power Amplifiers
Shun Beppu, Daisuke Araki, Takashi Soga, Yuuma Noguchi, Masatoshi Hase, Satoshi Goto, Hisashi Yamazaki (Murata Manufacturing Co., Ltd.)
4 Digital Pre-Distortion Technique for GaN Power Amplifiers (TBD)
Mochida Eiji (Sumitomo Electric Industries, Ltd.)

FR3B  Workshop

Nov. 27 (Fri)  14:00-16:00   Room 3 (Annex Hall F203)
Advanced Rectifier Technologies for Microwave Power Transfer : Perspectives from Devices, Circuits, and Systems
Organizers :  Shinichi Tanaka (Shibaura Inst. of Tech.)
Chair :   Hirotaka Asami (Sumitomo Electric Industries, Ltd.)
Microwave power transfer (MPT) is expected to enable a wide range of applications, from low-power RF energy harvesting to high-power wireless power delivery, and to play an important role in future society. Achieving high overall system efficiency, however, requires continued advances in rectifying devices and rectifier circuit technologies. The technical requirements vary significantly depending on the power level, operating frequency, and system architecture.
This session will discuss the current status and challenges of MPT rectification technologies from device, circuit, and system perspectives, and explore future directions for their development.

Keyword : Wireless Power Transfer, Rectifier, Diode, FET, Wide Bandgap, Millimeter-Wave
1 Technical Challenges of Wide-Bandgap Rectifying Devices for Microwave Power Transfer
Yasuo Ohno (Laser Systems Inc.)
2 A Diode-Inspired Design Approach for Time-Reversal-Dual FET Rectifiers
Shinichi Tanaka (Shibaura Inst. of Tech.)
3 Wirelessly Powered Relay Transceivers using Millimeter-Wave Rectifiers (TBD)
Atsuhi Shirane (Inst. of Science Tokyo)

FR4A  Workshop

Nov. 27 (Fri)  09:30-11:30   Room 4 (Annex Hall F204)
Latest Technologies and Future Prospects for Microwave Qubit Control Devices
Organizer / Chair :  Masaomi Tsuru (Mitsubishi Electric Corp.), Hidehisa Shiomi (Osaka Univ.)
Practical application of quantum computers requires a larger number of Qubits. In future large-scale qubit control systems comprising such as 10,000 or even a million qubits, it is essential to suppress thermal effects and supply stable microwave signals. Furthermore, advances in simulation technology are crucial for the development of superior microwave devices.
This workshop will present the latest technologies and the future prospects of adiabatic superconducting microwave circuits, microwave signal stabilization, and device and circuit simulations for large-scale Qubit control.

Keyword : Quantum Computer, Qubit Control, Superconducting Microwave Circuit, Microwave Signal Stabilization, Device and Circuit Simulation
1 Adiabatic Superconducting Microwave Circuits for Scalable Qubit Control
Naoki Takeuchi (Tohoku Univ.)
2 Microwave Signal Stabilization in Qubit Control Systems : An Approach Based on Device-Level Te
Yoshinori Kurimoto (QuEL, Inc.)
3 Current Status and Challenges of Device and Circuit Simulations for Large-Scale Integration of Silicon Qubits
Tetsufumi Tanamoto (Teikyo Univ.)

FR4B  Tutorial

Nov. 27 (Fri)  14:00-16:00   Room 4 (Annex Hall F204)
Overview of Integrated Sensing and Communications (ISAC) and Its Application Cases
Organizers :   Hideya So (Kogakuin Univ.)、Satoshi Suyama (NTT DOCOMO Inc.)、Tomonori Murakami (NTT, Inc.)
Chair :   Tomonori Murakami (NTT, Inc.)
Integrated Sensing and Communications (ISAC) has attracted significant attention in recent years as a key technology enabling the secondary utilization of radio spectrum. As the era of 5G-Advanced (5G-A) and 6G approaches, sensing technology is expected to play a central role in their technological advancement.
This session will outline the standardization efforts and technological trends in ISAC, followed by an introduction to empirical demonstrations using cellular signals as practical applications of ISAC technology.

Keyword : Wireless Sensing, Integrated Sensing and Communications (ISAC), Standardization, Cellular
1 Standardization and Technical Trends Related to Integrated Sensing and Communications
Hideya So (Kogakuin Univ.)
2 Initiatives for Field Trials of Cellular Sensing
Masakatsu Ogawa (Sophia Univ.)

FR5A  Tutorial

Nov. 27 (Fri)  09:30-11:30   Room 5 (Annex Hall F205)
Wideband Filter Design and Implementation: Fundamentals and Case Studies
Organizer / Chair :  Masataka Ohira (Doshisha Univ.)
for microwave wideband filters, which are indispensable components of next-generation Ultra-Wideband (UWB) wireless communication systems supporting the emerging IoT and AI society, through a series of illustrative design examples.
Firstly, the limitations of applying conventional narrowband filter design theory to wideband filters are demonstrated through a specific example. Next, representative circuit configurations widely used in wideband bandpass filter design are introduced, and the theoretical design procedures are explained using practical examples. In addition, advanced design techniques are presented, including methods for improving skirt selectivity, introducing notch bands within a wide passband, and realizing dual-band characteristics.

Keyword : Wideband Filters, Synthesis, Theoretical Design, Equivalent Circuits, Applications
1 Wideband Filter Design and Implementation: Fundamentals and Case Studies
Chun-Ping Chen (Kanagawa Univ.)

FR5B  Workshop

Nov. 27 (Fri)  14:00-16:00   Room 5 (Annex Hall F205)
Recent Advances in High-Frequency Passive Circuits: From Microwaves to Terahertz
Organizer / Chair :  Chun-Ping Chen (Kanagawa Univ.)
To realize next-generation wireless communications such as 5G/6G and terahertz communications, high-frequency passive circuit technologies are required not only to achieve higher performance and enhanced functionality, but also to be integrated with emerging technologies such as artificial intelligence (AI), metamaterials, and microelectromechanical systems (MEMS).
This session focuses on passive circuit technologies spanning from the microwave to the terahertz frequency bands, and presents recent research advances in next-generation filter design using deep reinforcement learning, terahertz-wave control devices based on MEMS and metamaterials, and electronically controlled nonreciprocal metamaterial transmission lines. Through these presentations, the future prospects of next-generation high-frequency passive circuit technologies will be discussed.

Keyword : Microwave/Millimeter-Wave/Terahertz Passive Circuit, Artificial Intelligence (AI), MEMS, Metamaterials, Nonreciprocal Circuits, Filter Design, Electronic Control
1 Toward Next-Generation Microwave Filter Design : Fusion of Deep Reinforcement Learning and Surrogate Models
Masataka Ohira (Doshisha Univ.)
2 Terahertz Wave control Devices Based on MEMS and Metamaterials
Taiyu Okatani (Tokyo Denki Univ.), Yoshiaki Kanamori (Tohoku Univ.)
3 Electronic Control of Structural Asymmetry in Nonreciprocal Metamaterial Transmission Lines
Tetsuya Ueda (Kyoto Inst. of Tech.)

FR6A  Workshop

Nov. 27 (Fri)  09:30-11:30   Room 6 (Annex Hall F206)
Exploring Future Directions for Advanced Radar Sensing
Organizer / Chair :  Yasushi Takatori (Nanzan Univ.)
To create new value in wireless systems, utilizing wireless technology in non-communication fields is attracting significant attention. Now that automotive millimeter-wave radars for collision avoidance have become widely adopted, there is growing expectation for advancements in the radar and sensing domains, aiming for further market creation as the next step.
This workshop will widely introduce cutting-edge initiatives currently under study, including technological evolution toward 6G, the latest applications and future use cases of millimeter-wave radars, and innovations in wireless signal processing technology that serve as the core supporting these developments. Through these insights, we will explore the future direction of radar and sensing advancements toward next-generation deployments.

Keyword : Sensing, Radar, Millimeter Wave, 6G, Radar Applications, Signal Processing, Integrated Sensing and Communication, ISAC
1 Research and Development of Wireless Sensing Technologies Toward 6G
Tomonori Murakami (NTT, Inc.)
2 Applications of Wide-Field-of-View, Compact Millimeter-Wave Radar
〜 Examples of AGV / Drone Mounting 〜 (tentative)
Fuminori Sakai (Sakura Tech Corp.)
3 Beyond Sight-Expanding Our World with Radio Waves :
Introducing Signal Processing Technologies for Enhanced Sensing
Yuji Tanaka (Nagoya Inst. of Tech.)
4 Evolution of Radar Systems for Future Interference-Dense Environments
Yasushi Takatori (Nanzan Univ.)

FR6B  Workshop

Nov. 27 (Fri)  14:00-16:00   Room 6 (Annex Hall F206)
dvanced High-Frequency Substrate Technologies and Electromagnetic Materials for Millimeter-Wave and Sub-Terahertz Applications
Organizer / Chair :  Kunio Sakakibara (Nagoya Inst. of Tech.)
The realization of millimeter-wave and sub-terahertz technologies for next-generation wireless communications, sensing, radar systems, and electromagnetic wave control applications requires high-performance substrate materials, advanced manufacturing technologies, and functional electromagnetic materials.
This session will present recent developments in low-loss fluoropolymer substrates, PTFE-based high-frequency substrate materials, and multilayer PCB solutions, as well as fabrication technologies for fine-line patterning and microvia formation. In addition, terahertz-band electromagnetic wave absorbers will be introduced as emerging solutions for electromagnetic wave management and interference mitigation. From the perspectives of materials, fabrication, packaging, and electromagnetic wave control, the session provides an overview of key enabling technologies supporting next-generation high-frequency devices and systems.

Keyword : Millimeter-Wave and Sub-Terahertz Technologies, High-Frequency Substrate Materials, Low-Loss Dielectric Materials, Fine-Line and Microvia Fabrication Technologies, Electromagnetic Wave Absorbers
1 FLUOROCUIT(TM): A Low-Loss Fluororesin Substrate for Enhancing the Performance of Millimeter-Wave and Sub-Terahertz Planar Antennas
Yutaro Miki (Sumitomo Electric Industries, Ltd.)
2 Low-Loss, Low-Thermal-Expansion PTFE Substrate Materials and Multilayer PCB Solutions
Takeshi Okunaga (PILLAR Corp.)
3 Utilization of Micro Wiring Processing on Antenna Substrates
Hironori Takagi (Kansai Denshi Industries Co., Ltd.)
4 Film-Type Electromagnetic Wave Absorber for the Terahertz Band
Akiko Asami (Maxell, Ltd.)

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