Exhibition & Product
A101 | Ansys Japan K.K. |
A201 | R & K Co., Ltd. |
A202 | Sumitomo Electric Industrier, Ltd. |
A301 | Keycom Corp. |
A302 | Anritsu Corp. |
A303 | Yuetsu Seiki Co., Ltd. |
A401 | Shoshin Corp. |
A402 | Toshiba Corp. |
A403 | Kozo Keikaku Engineering, Inc. |
A404 | Nihon Koshuha Co., Ltd. |
A501 | Kawashima Manufacturing Co., Ltd. |
A502 | E-Song EMC Co., Ltd. |
A503 | TSS Japan, Co., Ltd. |
A504 | PTT Co., Ltd. |
A505 | Hittite Microwave Corp. |
B101 | Win Semiconductors Corp. |
B102 | Intertec Corp. |
B103 | PTM Corp. |
B104 | Ai Electronics, Ltd. |
B105 | Yokohama Denshi Seiko Co., Ltd. |
B106 | Itochu Techno-Solutions Corp. |
B107 | Toko Denshi Co., Ltd. |
B108 | Nakao Corp. |
B201 | Hi-Technology Trading, Inc. |
B202 | Omron Corp. |
B203 | U.S.Hi-Tech Industries Japan Corp. |
B204 | Toyo Medic Co., Ltd. |
B205 | Shinko Photo Service, Inc. |
B206 | Chronix, Inc. |
B207 | Sanken Corp. |
B208 | New Metals and Chemicals Co., Ltd. / Rogers Japan, Inc. |
B301 | MEL Inc. |
B302 | Netwell Corp. |
B303 | Daiken Chemical Co., Ltd. |
B304 | Maycom Japan Co., Ltd. |
B305 | Toyama Denki Building Co., Ltd. |
B306 | Naka & Co., Ltd. |
B401 | Fusoh Shoji Co., Ltd. |
B402 | Nihon Radiall K.K. |
B403 | Mini-Circuits Yokohama, Ltd. |
B404 | Cascade Microtech Japan, Inc. |
B405 | Idaqs Co., Ltd. |
B406 | Net Comsec Co., Ltd. |
B407 | Nippon Aircraft Supply Co., Ltd. |
B501 | Junkosha, Inc. |
B502 | ATN Japan, Ltd. |
B503 | Fujitsu, Ltd. |
B504 | Asnics Co., Ltd. |
B505 | Tecdia Co., Ltd. |
B506 | Mitsunami Co., Ltd. |
B507 | Systec Research, Inc. |
C101 | Innertron Japan Co., Ltd. |
C102 | AWR Japan K.K. |
C103 | Rohde & Schwarz Japan K.K. |
C104 | Candox Systems, Inc. |
C201 | NXP Semicondctors Japan, Ltd. |
C202 | AET, Inc. |
C203 | Vega Technology, Inc. |
C301 | Midoriya Electric Co., Ltd. |
C302 | HiSOL, INC. |
C303 | Oshima Prototype Engineering Co., Ltd. |
C304 | Arumotech Corp. |
C305 | Cascade Microtech Japan, Inc. |
C306 | Micro Wave Factory Co., Ltd. |
C401 | Kanto Electronics Application & Development, Inc. |
C402 | Agilent Technologies JAPAN, Ltd. |
C403 | Renasas Electronics Corp. |
C501 | NPS, Inc. |
C502 | AmTechs Corp. |
C503 | Nippon Pillar Packing Co., Ltd. |
C504 | Takitek K.K. |
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E101 | Waka Manufacturing Co., Ltd. |
E102 | Morita Tech Co., Ltd. |
E103 | Fuji Denka, Inc. |
E104 | PVJ, Inc. |
E105 | Technoprobe Co., Ltd. |
E106 | Kansai Denshi Industry Co., Ltd. |
E201 | Frontlynk Technorogies, Inc. |
E202 | Tokyo Keiki, Inc. |
E203 | Wakoh Communication Industrial Co., Ltd. |
E204 | Rikei Corp. |
E205 | Koden Electronics Co., Ltd. |
E206 | Hirai Seimitsu Kogyo Corp. |
E301 | Device Co., Ltd. |
E302 | WIPL-D (Japan), Inc. |
E303 | MITS Electronics |
E304 | MAJ Co., Ltd. |
E305 | Reprorise Inc. |
E306 | Seikoh Giken Co., Ltd. |
E401 | Comcraft Corp. |
E402 | Electronic Navigation Research Institute |
E403 | Komine Musen Denki Co., Ltd. |
E404 | AMT, Inc.
/ Keisoku Engineering System Co., Ltd. |
E405 | E&C Engineering K.K. |
E406 | Miyazaki Electric Wire & Cable Co., Ltd. |
E501 | Riken Dengu Seizo Co., Ltd. |
E502 | LPKF Japan Co., Ltd. |
E503 | Sonnet Giken Co., Ltd. |
E504 | Yokowo Co., Ltd. |
E505 | Wave Technology, Inc. |
E506 | MPDevice Co., Ltd. |
Sponcors / Publishers
B-1 | CQ Publishing Co., Ltd. |
B-2 | INCOM CO,. LTD. |
B-3 | EDN Japan |
B-4 | Mimatsu Corp. |
B-5 | MICROWAVE JOURNAL |
B-6 | IEICE |
S-1 | APMC 2011 |
S-2 | IEEE MTT-S |
S-3 | EuMA |
University Exhibition
01 | Toyohashi Univ. of Technology, Wave Engineering Lab. |
02 | Tokyo Institute of Technology, ARAKI Lab. |
03 | Tokyo Institute of Technology, SAKAGUCHI Lab. |
04 | Tokyo Institute of Technology, TAKADA Lab. |
05 | Osaka Institute of Technology, Communication Network Lab. / Intelligent Network Lab. / Osaka Univ., KOMAKI Lab. |
06 | of Science, MURAGUCHI Lab. |
07 | The Graduate Univ. for Advanced Studies / Japan Aerospace Exploration Agency, Institute of Space and Astronautical Science |
08 | Tokyo Institute of Technology, Solutions Research Lab., MASU Lab. |
09 | Tokyo Institute of Technology, MATSUZAWA and OKADA Lab. |
10 | Tohoku Univ., KATO & NAKASE Lab. |
11 | Tohoku Univ., SUEMATSU Lab. / Mobile Wireless Technology Group of IT-21 Center |
12 | Kyushu Univ., YOSHIDA, KANAYA and POKHAREL Lab. |
13 | Saga Univ., Communication Engineering Lab. |
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14 | Osaka Prefecture Univ., Astrophysics Lab. |
15 | Ehime Univ., MATSUNAGA Lab. |
16 | Yamaguchi Univ., Quantum Device and Materials, Applied Physics Lab. |
17 | Ryukoku Univ., AWAI & ISHZAKI Lab. |
18 | Kansai Univ., HORII Lab. |
19 | Okayama Prefectural Univ., OKUBO and KISHIHARA Lab. |
20 | Univ. of Hyogo, ENOKIHARA & KAWAI / OHTA Lab. |
21 | Kure National College of Technology, Advanced Electromagnetic Systems Lab. |
22 | Saitama Univ., MA-OHIRA Lab. |
23 | Aoyama Gakuin Univ., HASHIMOTO Lab. |
24 | Kyoto Institute of Technology, Microwave Engineering Lab. |
25 | Nagoya Institute of Technology, Electroceramics Lab. |
26 | Tokyo Institute of Technology, ANDO and HIROKAWA Lab. |
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27 | Kumamoto Univ., FUKUSAKO Lab. |
28 | Tohoku Univ., MIZUNO, SAWAYA Lab. |
29 | The Univ.of Tokyo, HIROSE Lab. |
30 | Kyoto Univ., SHINOHARA Lab. |
31 | Tokyo Univ. of Science, KOSHIJI Lab. |
32 | Chiba Univ., ITO and TAKAHASHI Lab. |
33 | Kokushikan Univ., NIKAWA Lab. |
34 | Utsunomiya Univ., KOGAMI and SHIMIZU Lab. |
35 | Hachinohe Institute of Technology, SHIBATA Lab. |
36 | The Univ. of Electro-Communications, YAKABE Lab. |
37 | Waseda Univ. YOSHIMASU Lab. |
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38 | Shanghai JiaoTong Univ., CHINA |
39 | National Central Univ., TAIWAN |
40 | National Taiwan Univ., TAIWAN |
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