| C [ Application Systems ] |
|
| Workshop 01 |
Nov 28 (Wed). 13:15-16:00 |
Room F205 |
Millimeter-Wave Technology ：
Recent Progress and Perspectives on Circuit Technologies and Applications
Organizers : Shigeo Kawasaki, Kyoto Univ., Munenari Kawashima (NTT)
Chair : Yukio Takimoto (Kyoto Univ.) |
- 1
-
Passive Millimeter-Wave Imaging Technologies and Their Applications
Koji Mizuno (Tohoku Univ.)
|
- 2
-
Research and Standardization Activity for IEEE802.15.3c mmW WPAN
-Design of PHY Layer-
Hiroshi Harada (NICT)
|
- 3
-
Present Status and Perspectives of Quasi -Millimeter- Wave/Millimeter-Wave MMICs
Tomio Satoh (Eudyna Devices Inc.)
|
- 4
-
Basic Technologies for Developing Passive Devices and HICs in the Millimeter-Wave Band
Toshio Ishizaki (Panasonic Electronic Devices Co., Ltd.)
|
| C [ Application Systems ] |
|
| Workshop 02 |
Nov 28 (Wed). 13:15-16:00 |
Room F206 |
Advanced Wireless Technologies for Safety and Security
Organizer/Chair : Yo Yamaguchi (NTT) |
- 1
-
Recent Progress in Inter-Vehicle Communication Technology for Safety and Security
Kenji Ito (Toyota Central R&D Labs., Inc.)
|
- 2
-
JAXA's Experiments and Demonstration Satellites for Safety and Security
Kazuharu Yamada (JAXA)
|
- 3
-
Advanced Ad-hoc Network Technology for Safety and Security
Hiraku Okada (Niigata Univ.)
|
- 4
-
Advanced Wireless ICT Solution for Safety and Security
Masayuki Tonozuka (NTT Comunications Corp.)
|
| B [ Passive Devices ] |
|
| Workshop 03 |
Nov 29 (Thu). 09:00-11:45 |
Room F204 |
Recent Progress in Measurement Techniques for Low-Loss Materials and Technologies of New Materials for Millimeter-Wave Modules
Organizer : Kenichi Maruhashi (NEC Corp.)
Chair : Tamotsu Nishino (Mitsubishi Electric Corp.) |
- 1
-
Recent Studies of Millimeter-Wave Measurement Methods for Complex Permittivity of Low-Loss Materials
Akira Nakayama, Kyocera Corp.
|
- 2
-
Fruororine Resin PC Board Expected in Millimeter-Wave Bands
Koichi Shimauchi, Teruyuki Tanigaki, Hitoshi Kanzaki (Nippon Pillar Packing Co., Ltd.)
|
- 3
-
Recent Trends in Microwave and Millimeter-Wave Components Using Liquid Crystal Polymer
Takeshi Yuasa, Hideyuki Oh-hashi, Hideki Asao (Mitsubishi Electric Corp.)
|
- 4
-
60GHz Transceiver Module Using 3D-SiP
Hiroyuki Nakase, Hiroshi Oguma, Suguru Kameda, Tadashi Takagi, Kazuo Tsubouchi (Tohoku Univ.)
|
| A [ Active Devices ] |
|
| Workshop 04 |
Nov 29 (Thu). 09:00-11:45 |
Room F205 |
Advanced Passive Technologies for Highly Integrated Si RF CMOS ICs
Organizers : Takana Kaho, Kenjiro Nishikawa (NTT)
Chair : Tsuneo Tsukahara (The Univ. of Aizu) |
- 1
-
Trend of Si RF CMOS Integrated Circuits
Kazuya Masu (Tokyo Institute of Technology)
|
- 2
-
Modeling of On-Chip Transmission-Lines -Impact of Orthogonal Wires, Si Substrate and Dummy Fills-
Akira Tsuchiya (Kyoto Univ.)
|
- 3
- On-chip Antennas Fabricated on Silicon Substrates and Their Applications
Kenneth K. O. (Univ. of Florida)
|
- 4
-
A Realization and Its Problems of Passive Devices on Silicon Integrated Circuits
Nobuyuki Itoh (Toshiba Corp.)
|
| C [ Application Systems ] |
|
| Workshop 05 |
Nov 29 (Thu). 09:00-11:45 |
Room F206 |
Spectrum Sharing with Cognitive Radio
Organizers : Yukitoshi Sanada (Keio Univ.), Jun-ichi Takada (Tokyo Institute of Technology)
Chair : Yukitoshi Sanada (Keio Univ.) |
- 1
-
Technology Trends and Challenges of Dynamic Spectrum Access
Takeo Fujii (The Univ. of Electro-Communications)
|
- 2
-
Sharing Study in ITU-R ; a View from Radiowave Propagation
Akio Sato (Tokyo Engineering Univ.)
|
- 3
- Interference and DAA Issues in UWB Systems
Bin Zhen, Huan-bang Li, Ryuji Kohno (NICT)
|
- 4
-
Standardization of Cognitive Radio Technology in IEEE 802.22
Shigenobu Sasaki (Niigata Univ.)
|
