Workshop
Workshop
07
|
Thursday, November
27, 14:00 to 17:00 |
Room F201+F202 |
Next Generation Wireless Communication Systems
Organizer/Chair Hidekazu Murata (Tokyo Institute of Technology) |
1. Technology Trends of OFDM Communication Systems
Tomoaki Ohtsuki (Tokyo Univ. of Science) |
2. Coverage and Throughput of Multihop CDMA Cellular System
Atsushi Fujiwara,
Shinji Takeda, Hitoshi Yoshino, Narumi Umeda (NTT
DoCoMo) |
3. Spatial Multiplexing Communication Systems
Hidekazu Murata (Tokyo Institute of Technology) |
4. Software Defined Radio Technologies
Araki Katsuhiko,
Uehara Kazuhiro, Nakagawa Tadao, Kawashima Munenari, Shiba Hiroyuki,
Shono Takashi, Hayashi Hitoshi, Umehira Masahiro
(NTT) |
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Workshop
08
|
Thursday, November
27, 14:00 to 17:00 |
Room F203 |
Low Cost Packaging Technologies for Microwave and
Millimeter-Wave Applications
Organizer/Chair Masayoshi Aikawa (Saga Univ.) |
1. Flip-Chip MMICs and Packaging Technology for Millimeter-Wave
Applications
Yoji Ohashi (Fujitsu Laboratories Ltd.) |
2. 60GHz Band Compact and High-Efficient Front-End Modules
Utilizing Dielectric
Lens Antenna Structure
and MEMS Technologies
Ushio Sangawa (Matsushita Electric
Industrial Co., Ltd.) |
3. Microwave Circuits on a Dielectric-Air-Metal (DAM)
Structure by Silicon
Micromachine Technology
Tamotsu Nishino (Mitsubishi Electric Corp.) |
4. Recent Progresses in Millimeter-Wave Integrated Circuits
Based on the NRD
Guide Technology
Futoshi Kuroki (Kure National College
of Technology) |
5. Application of Thick Film Multilayer Ceramic Substrate for
Low-Cost Millimeter-Wave Rader
Hideyuki Nagaishi,
Horoshi Shinoda, Horoshi Kondoh, Kazuaki Takano
(Hitachi, Ltd.) |
6. Development of Quasi-Millimeter Wave Transceiver with Low
Cost SMT Packages
Masaaki Ishida,
Koichiro Gomi, Norio Matsui (Toshiba Corp.) |
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