Secretariat of  MWE 2008 c/o Real Communications Corp. 3F Shin-Matsudo S Building 1-409,  Shin-Matsudo, Matsudo-City.  270-0034 Japan TEL. 047-309-3616  FAX. 047-309-3617 E-mail : mweapmc@io.ocn.ne.jp

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workshop Program

Workshop


D [ Systems ]@Workshop 07

Nov. 27 (Thu),  09:00-11:45     Room  F206
Latest Trends in Sensing Technologies Using Microwaves,
Millimeter Waves, and Terahertz Waves
Organizer / Chair :  Tadao Nagatsuma (Osaka Univ.)
1Microwave is Generated from Material Destructions  - Its Mechanism and Applications -
Tadashi Takano (JAXA, Nihon Univ.), Ken-ichiro Maki (RIKEN), Eriko Soma (JAXA),
Hiroko Ohnishi (Kansai Electric Power Co.), Shigeo Chiba (The Univ. of Tokyo),
Akira Fujiwara (JAXA), Shingo Yoshida (Earthquake Research Institute / The Univ. of Tokyo)
2Microwave / Millimeter-Wave Radiometer System and Its Application
Hiroki Tanida, Kiyotaka Tanaka, Akihito Yamamoto, Akio Iida (Mitsubishi Electric Tokki Systems Corp.)
3Millimeter-Wave TV Camera  
     - Active Millimeter-wave Imaging System using Frequency-Encoding Technique -
Toru Iwasaki, Hirokazu Kamoda, Thomas Derham, Takao Kuki (NHK)
4Current Status and Future Prospects of Terahertz Sensing Technology
Ryoichi Fukasawa (Spectra Design Ltd.)
 

A [ Passive Circuit ]@Workshop 08

Nov. 27 (Thu),  13:30-16:15     Room  F203
Potentials of Novel Metamaterial / Material Techniques for
Microwave Passive Devices
Organizer / Chair :  Atsushi Sanada (Yamaguchi Univ.)
1Potential Applications and Prospect of Metamaterials for Microwave Passive Devices
Atsushi Sanada (Yamaguchi Univ.)
2Compact Metamaterial-Based Antenna Arrays and Subsystems for MIMO Applications
Maha Achour, Ajay Gummalla, Cheng-Jung Lee, Gregory Poilasne (Rayspan Corp.)
3Skin Effect Suppression in RF Devices Using a Multilayer of Conductor and
     Ferromagnetic Thin Film with Negative Permeability
Masahiro Yamaguchi, Yutaka Shimada, Takayoshi Inagaki (Tohoku Univ.),
Behzad Rejaei (Delft Univ. of Technology)
4High-Frequency Electromagnetic Properties in the Artificial Nano-Scale Magnets  
     - Control of Magnetic Structure and High-Frequency Electromagnetic Response -
Akinobu Yamaguchi, Nana Higashio, Keiichi Motoi, Hideki Miyajima (Keio Univ.)
 

B [ Active Circuit ]@Workshop 09

Nov. 27 (Thu),  13:30-16:15     Room  F204
High Frequency Technologies for GaN Based Devices and Circuits
Organizer / Chair :  Yasunori Tateno (Eudyna Devices Inc.)
1Future Prospects of Nitride Semiconductor Electron Devices
Masaaki Kuzuhara (Univ. of Fukui)
2GaN HEMT High Efficiency Power Amplifier
Koji Yamanaka, Hiroshi Ohtsuka, Hifumi Noto, Yoshitaka Kamo, kira Inoue, Moriyasu Miyazaki
(Mitsubishi Electric Corp.)
3Current Status of X-Band and Ku-Band High Power GaN HEMTs
Kazutaka Takagi (Toshiba Corp.)
4GaN-HEMT for Millimeter - Wave Application
Toshihide Kikkawa (Fujitsu Ltd.)
 

A [ Passive Circuit ]  B [ Active Circuit ]@Workshop 10

Nov. 27 (Thu),  13:30-16:15     Room  F205
Simulation Techniques for Microwave and Millimeter-Wave Silicon ICs
Organizer / Chair :  Naoko Ono (Toshiba Corp.)
1Harmonic Balance Analysis of Highly Nonlinear Analog Circuits and Its Application to
     Recent Circuit Designs
Noriyoshi Hashimoto (Agilent Technologies Japan, Ltd.)
2High Speed and RF Circuit Analysis Techniques in Time Domain
Tetsuhisa Mido (Synopsys, Inc.)
3Modeling of an On-Chip Transmission-Line by Utilizing EM Simulator
Takashi Kotera (Ansoft Japan K.K.)
4Modeling of Passive Elements in High Frequency Si-IC Considering Dummy Fill
Akira Tsuchiya, Hidetoshi Onodera (Kyoto Univ.)
 

B [ Active Circuit ]  D [ Systems ]@Workshop 11

Nov. 27 (Thu),  13:30-16:15     Room  F206
Advanced Short-Range Wireless Communication Technologies
for New Applications
Organizer / Chair :  Kenichi Maruhashi (NEC Corp.)
1CMOS Proximity Communications Technology
Tadahiro Kuroda (Keio Univ.)
2Communication Sheet Combining Wireless and Wireline Communications
Makoto Takamiya (The Univ. of Tokyo)
3Visible Light Communication and Integrated CMOS Optical Receiver
Yoshinori Matsumoto (Keio Univ.)
4Prospect for Wireless Communication System in the Terahertz Frequency Range
Iwao Hosako (NICT)
 

A [ Passive Circuit ]@Workshop 12

Nov. 28 (Fri),  09:00-11:45     Room  F203
Recent Progress in Substrate Materials with Low Loss and
High Performance for Millimeter-Wave Components
Organizers :  Tomohiro Seki (NTT), Hiroshi Okazaki (NTT DOCOMO, INC.)
Chair :  Tomohiro Seki (NTT)
1PWB Material and Manufacturing Accuracy for Millimeter-Wave Frequency Band seen 
     from Printed- Circuit Manufacturer
Shigeru Nagahara (Kyoei Electric Co., Ltd.)
2High Frequency Properties of Liquid Crystal Polymer Base Material "BIAC" and
     Its Board Applications
Sunao Fukutake (Japan Gore-Tex Inc.)
3Material and Design of Millimeter wave devices for compatibility of Electrical and 
     Thermal Characteristics
Noboru Kubo, Norikazu Fukunaga, Yoshio Tsukiyama, Masato Ishizaki
(Sumitomo Metal (SMI) Electronics Devices Inc.)
4LTCC Substrate and Millimeter-Wave Components
Hiroshi Uchimura, Kentarou Miyazato (KYOCERA Corp.)