Technical Programs

WORKSHOP  Tuesday, December 12  09:00-12:00
WORKSHOP  Tuesday, December 12  13:30-16:30
Tuesday, December 12   13:30-16:30

Room A (301)
Workshop 07
Recent Progress in High Power Widegap Semiconductor Device and its Application to Wireless Communication System
Organizer: Hajime Okumura, National Institute of Advanced Industrial Science and Technology (AIST), Japan
Chair: Hajime Okumura, National Institute of Advanced Industrial Science and Technology (AIST), Japan
For the development of information and communication technology to support the advanced information society of the 21st century, the large-capacity high-speed information communication connecting a wide range of information processing hardware to a network is indispensable. It is wireless communication technology, together with optical communication technology. In the wireless communication, one hundred and several tens of Mbps class speed will be required for a mobile access system; and a high-power high-frequency (HF) device operating with high efficiency in the frequency range from several GHz to several tens of GHz is the most important key issue for this purpose.

In this technological domain, any essential development cannot be expected even though there are huge needs, as long as conventional semiconductor devices made of Si or GaAs are used, because the characteristic parameters of Si and GaAs are not enough as semiconductor materials. For a breakthrough in this domain, the development of high-performance devices made of widegap semiconductors such as GaN is indispensable. Recently, the innovation has come to exhibit a reality owing to the progress of device process and crystal growth technologies for the widegap semiconductors.

In this workshop, the role of wireless communication in the IT society and the present status of widegap semiconductor highpower HF devices are introduced, and the future prospect is discussed.
Widegap Semiconductor High-Frequency Device in Future IT Society
Masaaki Kuzuhara, Fukui Univ., Japan
Physics and Prospects of III-Nitride MIS Devices
Narihiko Maeda, NTT, Japan
High Power GaN-Based Heterojunction FETs for Base Station Applications
Y. Ando, Y. Okamoto, A. Wakejima, T. Inoue, T. Nakayama, Y. Murase, K. Ota, K. Yamanoguchi, N. Kuroda, M. Tanomura, K. Matsunaga, H. Miyamoto, R&D Association of Future Electron Devices, Japan



Room B (302)
Workshop 08
Application of CIP Method to Electromagnetic Phenomena
Organizer: Takashi Yabe, Tokyo Institute of Technology, Japan. Yoichi Ogata, Tokyo Institute of Technology, Japan
Chair: Takashi Yabe, Tokyo Institute of Technology, Japan
The CIP method (Cubic Interpolated Propagation / Constrained interpolation Profile) that gives quite accurate and less-diffusive results is known as a powerful hyperbolic equations solver. The CIP method has been developed to various sophisticated versions, and although it has been applied to all kinds of phenomena like hydrodynamics for around 20 years, it is proved that CIP method is very effective for electromagnetic phenomena that can be also described by hyperbolic equations system as well, compared to the other conventional schemes.

In this workshop, new improvement of simulation techniques by CIP method and the latest practical applications of CIP method for electromagnetic phenomena will be presented. The subject matter ranges widely, such as "electromagnetic field analysis based on Maxwell's Equations", "plasma physics and astrophysics based on magnetohydrodynamics (MHD)" and "thermal radiation". In order to discuss the theme from these points mentioned above, we have invited six distinguished speakers.
Plasma and Fluid Flow in Magnetohydrodynamical Energy Conversion
Yoshihiro Okuno, Tokyo Institute of Technology, Japan
Appliciation of CIP-Based MHD Code in Astrophysics
Takahiro Kudoh, National Astronomical Observatory of Japan, Japan
CIP Method of Characteristics for Maxwell Equation
Yoichi Ogata and Takashi Yabe, Tokyo Institute of Technology, Japan
Modified CIP Method for Light Propagation in Absorbing Media
Daisuke Barada*,**, Takashi Fukuda*,**, Masahide Itoh**, and Toyohiko Yatagai**, *AIST, **Univ. of Tsukuba, Japan
Simulation of Thermal Radiation Emitted from Atomic Lattice through CIP and MD Methods
Takushi Kawaguchi, Teppei Masuhara, and Katsunori Hanamura, Tokyo Institute of Technology, Japan
Numerical Analysis for Thermal Radiation Emitted from a Ni Recutangular Micro-Cavity
Daisuke Hirashima, Yuki Kameya, and Katsunori Hanamura, Tokyo Institute of Technology, Japan



Room C (303)
Workshop 09
Phase Noise in Oscillator: An Old and Still New Technical Issue
Organizer: Kenji Itoh, Mitsubishi Electric Corp., Japan
Co-organizer: Takashi Ohira, ATR, Japan
Chair: Kenji Itoh, Mitsubishi Electric Corp., Japan
Phase noise is an old and still new technical issue for oscillator designers. For fundamental understandings on phase noise, we need knowledge on communication system, PLL system, oscillator circuits, semiconductor devices, resonators and mathematical representation of phase noise itself. This makes difficulties for understanding of oscillator phase noise. In this workshop, phase noise is discussed from several technical aspects:
(a) Phase noise influence on system performance of radio communication systems,
(b) Recent progress of low phase noise oscillators on Si RF-IC,
(c) Principal definition of "Leeson's Q" for phase noise characterization,
(d) Mathematical formulation method for phase noise simulation.
Welcome Address
Why Low Phase Noise in Modern Radio Systems ?
Kenji Itoh, Mitsubishi Electric Corp., Japan
Phase Noise in Modern Si-Integrated VCOs
Larry Larson, Univ. of California, San Diego, U.S.A.
A Simple but Persuading Approach to Oscillator Characterization
Takashi Ohira, ATR, Japan
Simulation Methods for Oscillator Noises
Makiko Okumura, Kanagawa Institute of Technology, Japan



Room D (304)
Workshop 10
High Frequency Technologies for ITS
Organizer: Kazuo Sato, Toyota Central R&D Labs. Inc., Japan
Chair: Kazuo Sato, Toyota Central R&D Labs. Inc., Japan
As further advances are made in sensing technologies and communication technologies in the future, ITS (Intelligent Transport systems) are expected to become more comprehensive, linking vehicles to infrastructures and even to people, through information. I believe that these advances in ITS will help decrease traffic accidents, traffic congestion and environmental impact. To realize next-generation ITS, various technologies, such as those for sensing, communications, information processing and high frequency technologies, need to be developed and integrated. In this workshop, the latest vehicular communication systems and high frequency technologies for ITS will be introduced. The first two presentations will focus on UWB (Ultra Wideband) ranging and inter-vehicle communication systems for car safety. The following two presentations will focus on electromagnetic simulation technique and design of automotive microwave and millimeter-wave applications, such as tire pressure monitoring systems, millimeter-wave radar systems and so on.
26GHz-Band UWB Ranging and Communication Systems
Yasushi Aoyagi, Masaharu Uchino*, Toshiyuki Hirose**, Kenichi Takizawa***, Kiyoshi Hamaguchi***, and Ryuji Kohno***, The Furukawa Electric Co., Ltd., *Anritsu Corp., **Siemens K.K., ***NICT, Japan
Inter-Vehicle Safety Communication Systems
Noriyoshi Suzuki, Toyota Central R&D Labs. Inc., Japan
Electrical Field Simulations of a Car and Applications
Yoshihide Yamada and Kazuo@Sato*, Satoru Horiuchi**, and Eiji Hirose***, National Defense Academy, *Toyota Central R&D Labs. Inc., **Yazaki Corp., ***The Yokohama Rubber Co., Ltd., Japan
Millimeter-Wave Antenna Technologies for Automotive Radar and Sensor Systems
Kunio Sakakibara, Nagoya Institute of Technology, Japan



Room E (311+312)
Workshop 11
Advanced Microwave Photonics Technologies and Their Applications
Organizer: Katsutoshi Tsukamoto, Osaka Univ., Japan
Chair: Katsutoshi Tsukamoto, Osaka Univ., Japan
A rapid progress in broadband wireless communication technologies accelerates the realization of ubiquitous networks, where various types of wireless and broadcasting services are converged in common infrastructure. Microwave photonics (MWP) can make a great contribution towards such a convergence between fixed and mobile communication (FMC), because its wideband and transparency capability for various types of wireless communication and broadcasting services will provide a seamless connectable common platform. In this workshop, the first two presentations will introduce the latest applications of MWP technologies to mobile communications and terrestrial broadcasting networks. Furthermore, the following two presentations will focus on future millimeter-wave photonic communication networks using coherent photonic techniques and advanced microwave-lightwave converter technology for RoF (radio on fiber) systems such as advanced optical SSB modulators, broadband photodetectors so on.
Future Millimeter-Wave Photonics Communication Networks
Toshiaki Kuri, NICT, Japan
Advanced Millimeter-Wave-Lightwave Converter Technology for ROF Systems
Hiroshi Murata, Osaka Univ., Japan
ROF Design Considerations for Mobile Phone System Applications
Yukio Horiuchi, KDDI, Co., Ltd., Japan
Recent Trends of Light Microwave Fused Technology in Broadcasting
Kazuhisa Haeiwa, Hiroshima City Univ., Japan



Room F (313+314)
Workshop 12
RF BAW Filters for Mobile Communications
Organizer: Ken-ya Hashimoto, Chiba Univ., Japan. Robert Weigel, Univ. of Erlangen-Nurnberg, Germany
Chair: Ken-ya Hashimoto, Chiba Univ., Japan. Robert Weigel, Univ. of Erlangen-Nurnberg, Germany
For long years, surface acoustic wave (SAW) filters have been widely used as the radio frequency (RF) front-end filters and duplexers for modern mobile communication systems. Recently, RF bulk acoustic wave devices (BAW) have been evolved surprisingly and are attempting to take over the current RF filter market from RF SAW devices. RF BAW devices are also paid much attention for the use as a core element for the development of sophisticated RF front-end and/or one-chip radio modules based on the system-on-chip (SoC) or system-in-package (SiP) integration with active circuitry.

In this workshop, speakers from leading-edge companies (Avagotech, Triquint/SAWTEK, Infineon Technologies, Fujitsu Labs, EPCOS) will report on the latest developments and future trends in the RF BAW devices for the mobile communications. Fabrication technologies and approaches will be discussed from various aspects for the realization of state-of-the-art RF BAW devices. Their implementation in RF modules will be demonstrated.
Overview of FBAR Filters, Duplexers, Quadraplexers, Quintiplexers, and Front End Modules (FEM) at Avago (formerly of Agilent)
Rich Ruby, Avagotech, U.S.A.
Bulk Acoustic Wave Filters for RF Applications
Gernot Fattinger, et al., TriQuint/SAWTEK, U.S.A.
Challenges and Success Factors of High Volume BAW Manufacturing in a CMOS Fab
Lueder Elbrecht, Infineon Technologies AG, Germany
FBAR and SAW Technologies and their Applications for Mobile Communications
Masanori Ueda, Fujitsu Laboratories, Japan
Solidly Mounted BAW Resonator Technology for Use in Mobile Communication Systems
Stefan Marksteiner, EPCOS AG, Germany